The Electronics Industry's Guide to: The Evolving PCB NPI Process
by Siemens Digital Industries
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About the Book
In this book, the authors look at how market changes in the past 15 years, plus the slowdown of production and delivery of materials and components in recent years, have affected the process for new product introduction (NPI) in the global marketplace. As a result, we feel that PCB production companies need to adapt and take a new direction to navigate and thrive in an uncertain and rapidly evolving future.
We'll look at how the NPI process can be streamlined by using a digital twin of the product design that can be transferred more easily and quickly, with greater collaboration and transparency, through manufacturing and ultimately to delivery to the customer. We also address new solutions that can help to better manage supply.
We'll look at how the NPI process can be streamlined by using a digital twin of the product design that can be transferred more easily and quickly, with greater collaboration and transparency, through manufacturing and ultimately to delivery to the customer. We also address new solutions that can help to better manage supply.
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About the Creator
IPC Publishing Group, Inc.
Bannockburn, IL
IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.